3D Bga Solder Reballing Net For A8 Model Stencil Ball Formation

Features

• Designed For Both Novice And Experienced Users.
• High Success Rate In Solder Ball Formation With Proficiency.
• Thicker Than Standard Stencils Reducing Deformation And Increasing Durability.
• Square Hole Design Facilitates Easy Removal Of Formed Solder Balls.
• Compact And For Professional Use.

Specification

• Model: A8
• Material: High-Quality Stencil Material
• Dimensions: Specific Dimensions Not Provided
• Weight: Specific Weight Not Provided

You Will Receive

• 1 X Mijing 3D Bga Solder Reballing Net Model A8